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| اسم العلامة التجارية | Customized |
| إصدار الشهادات | ISO9001, TS16949, ISO14001, |
| Product type | Copper base PCB Board |
| Applications | Industrial, Power |
| Surface Finishing | LF HAL |
| Thickness | 1.6mm |
| Feature | Copper Base PCB (MCPCB) | Normal FR4 PCB |
| Core Material | Solid Copper plate/core. | FR4 (Fiberglass woven cloth and epoxy resin). |
| Primary Advantage | Thermal Management (Heat Dissipation). | Cost-Effectiveness and Design Flexibility. |
| Thermal Conductivity (W/m·K) | Excellent: Up to 400 W/m·K (Pure Copper). | Poor: Typically 0.3 to 0.4 W/m·K (Epoxy Resin). |
| Current Handling | Very High. The thick copper base can also be used as a ground/power plane or heat sink. | Limited. Relies on the copper trace thickness (typically 1-2 oz). |
| Mechanical Strength | High Rigidity. The metal core provides excellent durability and resistance to warping/vibration. | Moderate. Sufficient for most consumer electronics but less robust. |
| Coefficient of Thermal Expansion (CTE) | Lower and Better Matched to the copper circuit layers. | Higher (especially in the Z-axis), leading to thermal stress and potential PTH/via failure during temperature cycling. |
| Design Flexibility | Limited Layer Count (mostly single or double-sided) due to the solid metal core. | Excellent. Supports complex, multi-layer designs (4, 6, 8+ layers) for high-density routing. |
| Cost | Higher. Copper is an expensive material, and processing is more specialized. | Low. Cost-effective and widely available for mass production. |
| Typical Applications | High-power LEDs, motor controllers, power supplies, automotive electronics, and high-frequency communication modules. | Consumer electronics (smartphones, computers), low-to-mid power devices, and complex digital circuits. |
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